On lithium cell seals, tabs and pack beads, the cycle is already faster than sampling.
A useful check has to land on a dimension: bead height and width at the seal, flatness of the thermal paste, breaks and height, and a tab that must sit inside a height band.
On one dispensing face the SG-500 checks path position, continuity, missing glue, excess, breaks and offset.
Boards run up to 500 × 500 mm, at 0.5 s per field of view.
PCB adhesive, damaged chip adhesive, flex-circuit beads, and corner-bond adhesive or glue climb on automotive parts and chips are the same class of station.
A point cloud that nobody compares with a limit does not change yield.
When the specification names bead height, climb height or thermal-paste height, the SG-500 can add a 3D line laser at a stated resolution of 0.0025 mm.
Serial numbers and 2D codes on the cell, module or pack are marked by the S350-X, S450-X or S500-X, each configurable as single side, flip both sides, or dual-head both sides.
The measurement and the code stay in the same record, rather than as an isolated picture on a local computer.
